EIC1010-25 10.0-10.25 ghz 25-watt internally matched power fet specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 1 of 4 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com revision 01 excelics 0.685 0.617 0.315 0.010 0.055 0.158 sn 0.803 0.945 yyww 2x 0.079 min 0.095 0.004 0.580 0.024 0.055 0.168 4x 0.102 features ? 10.0 ? 10.25 ghz bandwidth ? input/output impedance matched to 50 ohms ? +44 dbm output power at 1db compression ? 7 db power gain at 1db compression ? 33% power added efficiency ? hermetic metal flange package ? 100% tested for dc, rf, and r th electrical characteristics (t a = 25 c) caution! esd sensitive device. symbol parameters/test conditions 1 min typ max units p 1db output power at 1db compression f = 10.0-10.25ghz v ds = 9 v, i dsq 4000ma 43 44 dbm g 1db gain at 1db compression f = 10.0-10.25ghz v ds = 9 v, i dsq 4000ma 6.5 7 db ? g gain flatness f = 10.0-10.25ghz v ds = 9 v, i dsq 4000ma 0.6 db pae power added efficiency at 1db compression v ds = 9 v, i dsq 4000ma f = 10.0-10.25ghz 33 % id 1db drain current at 1db compression f = 10.0-10.25ghz 6500 7200 ma i dss saturated drain current v ds = 3 v, v gs = 0 v 11 16 a v p pinch-off voltage v ds = 3 v, i ds = 130 ma -2.5 -4.0 v r th thermal resistance 2 1.4 1.8 o c/w 1. tested with 15 ohm gate resistor, forward and reverse gat e current should not exceed 105ma and -10.5ma respectively 2. overall rth depends on case mounting. maximum rating at 25c 1,2 symbols parameters absolute 1 continuous 2 vds drain-source voltage 15 10v vgs gate-source voltage -5 -4v pin input power 38.5 dbm @ 3db compression tch channel temperature 175 o c 175 o c tstg storage temperature -65 to +175 o c -65 to +175 o c pt total power dissipation 83w 83w note: 1. exceeding any of the above ratings may result in permanent damage. 2. exceeding any of the above ratings may reduce mttf below design goals. EIC1010-25
EIC1010-25 10.0-10.25 ghz 25-watt internally matched power fet specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 2 of 4 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com revision 01 freq (9.700ghz to 10.60ghz) s(1,1) s(2,2) 9.8 9.9 10.0 10.1 10.2 10.3 10.4 10.5 9.7 10.6 -15 -10 -5 0 5 -20 10 freq, ghz db(s(2,1)) db(s(1,2)) s11 s21 s12 s22 frequency ghz mag ang mag ang mag ang mag ang 9.7 0.542 21.8 0.104 -48. 9 2.238 0.3 0.488 56.5 9.8 0.457 9.2 0.116 -65. 0 2.398 -15.2 0.467 41.0 9.9 0.349 -4.0 0.127 -81. 8 2.551 -31.9 0.432 23.5 10 0.218 -15.3 0.138 -100.3 2.675 -50.2 0.379 2.1 10.1 0.077 -9.8 0.143 -119.5 2.731 -69.2 0.322 -23.9 10.2 0.095 96.3 0.147 -139.0 2.684 -89.1 0.264 -58.3 10.3 0.232 94.4 0.144 -158.3 2.597 -107.8 0.243 -99.5 10.4 0.346 81.5 0.139 -176.3 2.42 -126.4 0.265 -136.7 10.5 0.428 67.9 0.132 166.7 2.212 -143.3 0.317 -165.0 10.6 0.479 54.5 0.125 150.6 2.029 -159.8 0.377 174.3 typical s-parameters (t= 25c, 50 ? system, de-embedded to edge of package) v ds = 9 v, i dsq 4000ma
EIC1010-25 10.0-10.25 ghz 25-watt internally matched power fet specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 3 of 4 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com revision 01 p1db v.s frequency 40 41 42 43 44 45 9.95 10 10.05 10.1 10.15 10.2 10.25 10.3 frequency/ghz p1db/dbm g1db v.s frequency 5.5 6 6.5 7 7.5 8 8.5 9.95 10 10.05 10.1 10.15 10.2 10.25 10.3 frequency/ghz g1db/db v ds = 9 v, i dsq 4000ma package outline dimensions in inches, tolerance + .005 unless otherwise specified excelics 0.685 0.617 0.315 0.010 0.055 0.158 sn 0.803 0.945 yyww 2x 0.079 min 0.095 0.004 0.580 0.024 0.055 0.168 4x 0.102 EIC1010-25
EIC1010-25 10.0-10.25 ghz 25-watt internally matched power fet specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 4 of 4 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com revision 01 disclaimer excelics semiconductor reserves the right to make changes without further notice to any products herein to improve reliabil ity, function or design. excelics does not assume any liability arising ou t of the application or use of any produc t or circuit described herein. life support policy excelics semiconductor products are not authorized for use as critical components in life support devices or systems with out the express written approval of excelics semiconductor, inc. as here in: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perf orm when properly used in accordance with instructions for use provided in the labeling, can be reasonably expect ed to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support dev ice or system, or to affect its safety or effectiveness.
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